KAIJO
FB-e20N
Fully Automatic High-Speed Wire Bonder
The FB-e20N is part of the latest generation of Kaijo ball bonder innovations. It is designed to meet all wire bonding requirements for a variety of applications including discrete components, LEDs and small component packages using either gold, copper or argentum alloy wire.
Features:
- Bonding area of 56 mm × 80 mm
- High versatility: optional versions for vertical LEDs, segment diodes or reel-to-reel procedure
- Advanced servo and enhanced design with a higher stiffness on both the X and Y axes
- Higher net productivity with highest yield
- α eyes – Kaijo’s improved recognition algorithm to avoid misalignment
- Step Bond Sequence – visualized fine process control for enhanced bonding results on small packages
- Dual-frequency transducer allows to select two frequencies per bond
- Real-time monitoring of wire deformation, transducer frequency and spark current
- SECS/GEM interface
- Barcode reader can be optionally integrated
- Automatic capillary cleaning
- Automatic threading of the wire into a capillary
