KAIJO
KAIJO exhibits Wire Bonder and Die Bonder.
KAIJO, over the course of its 60 years history as a leading ultrasonic technology company, is global total solution company in providing Wire Bonding Technology and Cleaning Process which satisfy customer demand with the cutting-edge technologies in electronics and mechatronics. In semiconductor, harddisc, medical, vehicle and other wide range of sectors.
FB-e20N
The FB-e20N is part of the latest generation of Kaijo ball bonder innovations. It is designed to meet all wire bonding requirements for a variety of applications including discrete components, LEDs and small component packages using ...
FB-x26
The Kaijo FB-x26 is a reliable wire bonder designed for larger-sized packages requiring a bonding area of up to 95 mm. It can handle either gold, copper or argentum wire and is also available as a model capable...
FB-i28
The FB-i28 is a sophisticated and highly accurate automatic wire bonder. With an outstanding speed of 0.045 seconds per wire and a repeat accuracy of ±2 µm, the system is state of the art.
