KAIJO
FB-x26
Fully Automatic Wire Bonder With Wider Area
The Kaijo FB-x26 is a reliable wire bonder designed for larger-sized packages requiring a bonding area of up to 95 mm. It can handle either gold, copper or argentum wire and is also available as a model capable for wafer-level bonding (FB-x26BUMP).
Features
- Wider bonding area of 56 mm × 95 mm, working area up to 295 mm × 105 mm
- α eyes – Kaijo’s improved recognition algorithm to avoid misalignment
- Advanced servo and enhanced design of the Z arm with lower mass and higher stiffness
- Robust and lightweight bonding head for high precision and low impact load
- Step Bond Sequence – visualized fine process control for enhanced bonding results
- High-speed touch detection function
- Ready for the demands of connectivity and Industry 4.0 thanks to SECS/GEM interface
- Barcode reader can be optionally integrated
- Automatic capillary cleaning
- Automatic threading of the wire into a capillary
