STI iSort Express
Intelligent, Intuitive And High Speed Die Sorter
iSORT Express is a cost-effective solution developed for high-speed die sorting jedec trays. Process knowledge from our widely acclaimed range of taping machines and vision engines was incorporated into its design – distinguishing it in a class of its own.
Using STI’s proprietary VISION technology, iSORT Express provides a state-of-the-art vision algorithm for inspecting wafer-level chip scale packages with unsurpassed accuracy and reliability. Aided with an intelligent vision-guided pick and place transfer, it ensures only devices that meet stipulated quality are placed into the output trays, ready for the next process step.
iSORT Express utilizes cutting-edge technologies in robotic motion control and as such comes packaged with a user-friendly interface, providing a truly robust solution for today’s demanding production environment.
Features
- Inspects Bump and Pad WLCSP devices
- True Measurement Method. Not just Template Matching
- 2D & 3D Wafer Bump Metrology provide Coplanarity measurement
- Bump damage detection metrology
- 12µm Edge and Corner- Chipping inspection accuracy
- Active Die Surface inspection using ATI's "Adaptive Tolerance" technology
- Carbon coated Die inspection
- 2D Matrix and OCR ready
- Automated accuracy check
- Colour Inspection Solution